Armstrong Fluid Technology introduces Generation Three Design Envelope pumps

Share With:

Armstrong Fluid Technology has announced the introduction of its Generation Three Design Envelope pumps featuring 33 advanced energy savings models ranging in sizes from one to 75HP.  All of these pumps are available for two to 10 day express shipment.

Expanding on its innovative Design Envelope (DE) technology that has saved building owners worldwide millions of dollars, the new pumps are designed to further increase building owners’ energy savings while providing more sustainable solutions.

Armstrong 3rd Generation 4300D
The new Generation 3 DE pumps also feature:

• TEFC Motors as standard to 25HP

• 230/460/575V options

• Fixed configuration codes for ease of product identification and order entry

• “Flat Map” selection

• Two to 10 day express shipment

• Exceeds ASHRAE 90.1 energy standard for buildings

Armstrong’s Design Envelope technology is built around four core competencies: heat transfer, fluid flow, variable speed, and demand based control. The technology delivers optimized lifetime building performance by modeling equipment and system behavior, monitoring authentic system conditions, and dynamically adjusting equipment operation to match system demand. This is achieved through specific Armstrong product combinations that make up a suite of solutions. Those products are pumping systems, booster systems, an Intelligent Fluid Management System (iFMS), an Integrated Plant Controller (IPC), a Chilled Water Integrated Plant Package (IPP), and Compass circulators.

For more information on Armstrong Fluid Technology products, visit

Join the conversation: